JPH0537516Y2 - - Google Patents
Info
- Publication number
- JPH0537516Y2 JPH0537516Y2 JP1987121739U JP12173987U JPH0537516Y2 JP H0537516 Y2 JPH0537516 Y2 JP H0537516Y2 JP 1987121739 U JP1987121739 U JP 1987121739U JP 12173987 U JP12173987 U JP 12173987U JP H0537516 Y2 JPH0537516 Y2 JP H0537516Y2
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- package
- conductive paste
- circuit element
- wave shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Conductive Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987121739U JPH0537516Y2 (en]) | 1987-08-07 | 1987-08-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987121739U JPH0537516Y2 (en]) | 1987-08-07 | 1987-08-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6426899U JPS6426899U (en]) | 1989-02-15 |
JPH0537516Y2 true JPH0537516Y2 (en]) | 1993-09-22 |
Family
ID=31369027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987121739U Expired - Lifetime JPH0537516Y2 (en]) | 1987-08-07 | 1987-08-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0537516Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2981755B2 (ja) * | 1990-04-24 | 1999-11-22 | 富士重工業株式会社 | 舵角信号の処理方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734354A (en) * | 1980-08-08 | 1982-02-24 | Mitsubishi Electric Corp | Packaging method of electronic parts |
JPS5858342U (ja) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | 混成集積回路 |
JPS60163751U (ja) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | 半導体装置 |
-
1987
- 1987-08-07 JP JP1987121739U patent/JPH0537516Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6426899U (en]) | 1989-02-15 |
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